With the development of LED lighting products, there are two new technologies: First, in order to increase the luminous flux of a single tube, a larger current density is injected, as mentioned below, so that the chip generates more heat and needs to be dissipated. Second, the new packaging structure, as the power of the LED light source increases, multiple power LED chips need to be packaged together, such as COB structure, modular lamps, etc., which will generate more heat and require more effective heat dissipation structure and measures, which brings a new topic to heat dissipation, otherwise it will greatly affect the performance and life of LED lamps.
At present, the total heat dissipation efficiency of LED lamps is only 50%, and there is still a lot of electric energy to be turned into heat. Secondly, LED high current density and modular lamps will generate more concentrated waste heat, which needs to be well dissipated.
Here are some suggestions for improving heat dissipation:
1) From the perspective of LED chips, it is necessary to adopt new structures and new processes to improve the heat resistance of the junction temperature of the LED chips and the heat resistance of other materials, so that the requirements for heat dissipation conditions are reduced.
2), reduce the thermal resistance of LED devices, adopt new packaging structure and new process, and select new materials with better thermal conductivity and heat resistance, including bonding materials between metals, mixed glue of phosphors, etc., so that thermal resistance ≤ 10°C/W or less.
3), reduce the temperature rise, try to use heat dissipation materials with good thermal conductivity, and require better ventilation channels in the design, so that the waste heat can be dissipated as soon as possible, and the temperature rise should be less than 30 °C. In addition, improving the cooling level of modular lamps should be on the agenda.
4) There are many ways to dissipate heat, such as the use of heat pipes, which is of course very good, but the cost factor should be considered, and the cost-effectiveness should be considered in the design.
In addition, the design of LED lamps should not only improve the efficiency of lamps, light distribution requirements, and beautiful appearance, but also improve the level of heat dissipation and use materials with good thermal conductivity. It has been reported that when the heat sink is coated with some nanomaterials, its thermal conductivity increases by 30%. %. In addition, it must have good mechanical properties and sealing, and the heat sink must be dust-proof.
luz LED de maíz Los productos son difíciles de disipar el calor. Por lo tanto, tiene esta característica especial, por lo que cada fabricante a menudo gasta una cierta cantidad de dinero en fabricar componentes de radiador cuando fabrica productos de lámparas de maíz. Es posible que la disipación de calor sea un gran problema para las lámparas de maíz.
Piezas de disipación de calor de la carcasa: LED resistente al agua lámpara de maíz has high requirements on heat dissipation effect and appearance process. In the industry, 6063 type aluminum material is generally used as heat dissipation conductor (high cost performance). It can achieve a good heat dissipation effect of the lamp beads. As an independent light source, corn lamps are widely used in indoor and outdoor environments. The whole lamp shell must meet the international standards, which are flame retardant, strong, pressure-resistant, dust-proof and waterproof. The material is generally PC material.tiene altos requisitos en cuanto al efecto de disipación de calor y el proceso de apariencia. En la industria, el material de aluminio tipo 6063 se utiliza generalmente como conductor de disipación de calor (rendimiento de alto costo). Puede lograr un buen efecto de disipación de calor de las perlas de la lámpara. Como fuente de luz independiente, las lámparas de maíz se utilizan ampliamente en ambientes interiores y exteriores. Toda la carcasa de la lámpara debe cumplir con los estándares internacionales, que son retardantes de llama, fuertes, resistentes a la presión, a prueba de polvo e impermeables. El material es generalmente material de PC.
